Back End of Line Semi-Conductor Equipment is the second part of semiconductor devices where single devices such as capacitors, transistors and resistors, among others are interconnected by wires on wafer which are made by pure silicon and metal layers to form required electrical circuits. Common metal that forms layers are aluminum interconnect and copper interconnect. Back end of the line in semiconductor equipments is started when the wafer gets deposited by the first layer of metal. Back end of line consists of metal levels, insulating layers (dielectrics), and bonding sites for chip to package connections. In back end of the line the formation of interconnect wires, contacts (pads), and dielectric structures takes place. Ten metal layers or more are added in back end of the line stage in semiconductor electronics. Steps of back end of line includes silicidation of the polysilicon region, drain regions and source, addition of dielectric and its processing, making holes in PMD in order to make contacts in them, adding the first metal layer, addition of second dielectric, connection of lower metal with higher metal by making vias through dielectric and passivation layer addition in order to protect the micro chip.
This market research analysis identifies the miniaturization of electronic devices as one of the primary growth factors for this market. The recent years have seen an increasing demand for compact electronic devices from several sectors such as communication, automotive, industrial manufacturing, and healthcare. This has induced the semiconductor manufacturers to invest in their R&D to reduce the size and increase the performance of ICs, which, in turn, has led to the emergence of micro-electro-mechanical systems (MEMS) and 3D chip packaging. Also, the increasing number of interconnects and transistors in the existing space on the ICs requires finer deposition, which in turn, will create the demand for BEOL semiconductor equipment. In addition, increasing technological functionalities in mobile devices is a major driver driving the global back end of the line semiconductor equipments market. Asia Pacific is expected to dominate the market share of the back end of the line semiconductor equipment global market.

Market Analysis and Insights: Global Back End of the Line Semiconductor Equipment Market
The global Back End of the Line Semiconductor Equipment market size is projected to reach US$ XX million by 2027, from US$ XX million in 2020, at a CAGR of XX% during 2021-2027.
With industry-standard accuracy in analysis and high data integrity, the report makes a brilliant attempt to unveil key opportunities available in the global Back End of the Line Semiconductor Equipment market to help players in achieving a strong market position. Buyers of the report can access verified and reliable market forecasts, including those for the overall size of the global Back End of the Line Semiconductor Equipment market in terms of revenue.
On the whole, the report proves to be an effective tool that players can use to gain a competitive edge over their competitors and ensure lasting success in the global Back End of the Line Semiconductor Equipment market. All of the findings, data, and information provided in the report are validated and revalidated with the help of trustworthy sources. The analysts who have authored the report took a unique and industry-best research and analysis approach for an in-depth study of the global Back End of the Line Semiconductor Equipment market.

Global Back End of the Line Semiconductor Equipment Scope and Market Size
Back End of the Line Semiconductor Equipment market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Back End of the Line Semiconductor Equipment market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application in terms of revenue and forecast for the period 2016-2027.

Segment by Type
CVD
CMP
Coater Developer
PVD
Metal Etching
Stepper
Wet Station

Segment by Application
Foundry
Memory
IDM

By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Nordic
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA

By Company
Applied Materials
ASML
KLA-Tencor
Tokyo Electron Limited (TEL)